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Graphene heat dissipation material "Graphene Flower SP"

Graphene heat dissipation material "Graphene Flower SP"

A quarter the weight of copper! It has high heat dissipation performance that balances high thermal conductivity and thickness.

The "Graphene Flower SP" has high heat dissipation performance that balances high thermal conductivity and thickness. It is 1/4 the weight of copper (density 2.2g/cm3) and allows for control of the direction of thermal conductivity. Additionally, compared to conventional thin graphite, it achieves extremely high heat dissipation performance due to the effect of thickness. 【Features】 ■ High heat dissipation performance that balances high thermal conductivity and thickness ■ 1/4 the weight of copper (density 2.2g/cm2) ■ Directional control of thermal conductivity is possible ■ Extremely high heat dissipation performance can be achieved due to the effect of thickness *For more details, please refer to the PDF document or feel free to contact us.

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Graphene heat dissipation material "Graphene Flower SP"

Graphene heat dissipation material "Graphene Flower SP"

This is a high-performance heat sink that achieves both high thermal conductivity and thickness. The direction of heat conduction can be controlled either in the plane direction or in the vertical (thickness) direction.

This is a heat dissipation plate made from high-oriented graphite, which has been graphitized using a unique molding technology with graphene as the raw material, and can be cut to any thickness. It has a thermal conductivity of over twice that of copper (700-1000 W/m·K), is lightweight with a bulk density of one-fourth that of copper (2.2 g/cm³), and excels in sound wave permeability. You can choose between the XY type with high thermal conductivity in the plane direction and the XZ type with high thermal conductivity in the vertical (thickness) direction. Its machinability is the same as that of general graphite, and it can be processed using grinding wheels and milling machines. It is also possible to process and deliver it in the specified shape within the designated size. Prototypes can be made from a single piece. For details, we will propose the optimal heat dissipation material after consultation. Applications: Heat transfer in the thickness direction for high-output devices such as inverters (thickness of 2 mm or more), heat dissipation plates for thermal diffusion requiring a thickness of 1 mm or more, and other heat dissipation plates requiring thickness for smartphones, laptops, tablets, etc.

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